JEDEC Trays For Diverse Components With Unrestricted Interior Design
The JEDEC standard is a masterclass in flexibility, achieved by rigorously defining the external envelope while intentionally leaving the internal cavity undefined and unrestricted. This design philosophy has allowed JEDEC matrix trays to evolve far beyond their original purpose as IC carriers. Today, the 12.7 x 5.35 inches (322.6 x 136mm) standardized footprint acts as a universal docking station for an unlimited variety of products and components, not just integrated circuits. This adaptability means industries outside of traditional electronics, such as medical device manufacturing and optics, can leverage the massive installed base of JEDEC-compatible automation equipment and the global support infrastructure. The trays are manufactured to be strong, stackable, and ESD-safe, but the interior geometry is completely customized to the specific part, whether it is a leaded semiconductor, a complex mechanical assembly, or a delicate optical lens.
Features:
The primary benefit is the adaptability and compatibility that stems from the open internal design.
1. Unlimited Product Versatility (Compatibility): Since the internal matrix is unrestricted, the JEDEC outline can be used to handle virtually any component that fits within the footprint.
2. Leveraging Existing Automation: By adopting the JEDEC outline, companies in diverse fields gain instant compatibility with standard JEDEC tray feeders, stackers, and robotic handlers, significantly reducing their capital investment in specialized handling hardware.
3. Convenient and Practical Features: The standard features, like the 45-degree chamfer for orientation and designated space for marking and engraving, remain practical tools for internal logistics and process control, regardless of the component type being handled.
4. Stackable and Protected Logistics: The trays' interlocking and stackable design, coupled with ESD-safe materials, offers a universal, protected solution for the storage and transport of diverse, high-value components, ensuring protection from mechanical damage during global transit.
Technical Parameters:
| Brand |
Hiner-pack |
| Model |
HN24160 |
| Material |
MPPO |
| Package Type |
IC Component |
| Color |
Black |
| Resistance |
1.0x10e4-1.0x10e11Ω |
| Outline Line Size |
322.6x135.9x7.62mm |
| Cavity Size |
2.7*3.3*1.04mm |
| Matrix QTY |
12*30=360PCS |
| Flatness |
MAX 0.76mm |
| Service |
Accept OEM, ODM |
| Certificate |
RoHS, IOS |
Applications:
The application of JEDEC trays has expanded far beyond their origins in the semiconductor industry.
- Non-Electronic Component Handling: This includes the handling of lenses, watch parts, and small metal pieces where a standardized, precise matrix is required for automated inspection or assembly.
- Complex Electronic Components: They are used for the secure transport and presentation of diverse electronic parts, such as connectors, specialized sockets, miniaturized PCBs, and MEMS (Micro-Electro-Mechanical Systems), which have unique handling requirements but benefit from the standardized external interface.
- Standardized Logistics Across Divisions: For large companies with diverse product lines (e.g., automotive, medical, and consumer electronics), JEDEC trays provide a single, common standard for logistics and component inventory across all divisions, simplifying global supply chains.
Customization:
The internal cavity is where the true customization magic happens, transforming a generic carrier into a perfect fit for a unique part.
- The internal cells are custom-molded to the exact shape and size of the component, providing a secure, non-moving fit.
- Adaptable Material Selection: Customization allows for specifying a material with specific properties.
- Bespoke Matrix Layout: The number of rows and columns (capacity) and the component pitch can be entirely customized to the part's size, maximizing the parts-per-tray ratio.
