JEDEC Trays ESD-Safe Carriers For Static-Sensitive Devices And IC Components
In the electronics industry, Electrostatic Discharge (ESD) protection is non-negotiable, and JEDEC matrix trays are the standard solution for securely handling and transporting ESD-sensitive devices (ESDs). While JEDEC does not specify the tray material, manufacturers universally utilize ESD-safe polymers for the majority of applications. These materials are typically rendered conductive through the infusion of carbon, which gives the default tray color of black. This conductivity ensures that any static charge is safely dissipated, preventing catastrophic or latent damage to sensitive ICs, modules, and assemblies. The JEDEC tray, with its fixed 12.7 x 5.35 inches (322.6 x 136mm) outline, acts as a standardized, grounding-compatible carrier, integrating seamlessly into existing ESD-protected workstations and assembly lines. The physical construction, characterized by strength and minimum twist, works in concert with the ESD-safe material to provide a comprehensive protection system: mechanical, dimensional, and electrical.
Features:
The primary benefit of these JEDEC trays is the integrated ESD protection coupled with dimensional precision.
1. Integrated ESD Safety
2. Industry Standard for Safety
3. Thermal and ESD Integrity
4. Automation Reliability
5. Stackable Protection
Technical Parameters:
| Brand |
Hiner-pack |
| Model |
HN24159 |
| Material |
MPPO |
| Package Type |
IC Component |
| Color |
Black |
| Resistance |
1.0x10e4-1.0x10e11Ω |
| Outline Line Size |
322.6x135.9x7.62mm |
| Cavity Size |
2.1*3.3*1.04mm |
| Matrix QTY |
12*30=360PCS |
| Flatness |
MAX 0.76mm |
| Service |
Accept OEM, ODM |
| Certificate |
RoHS, IOS |
Applications:
ESD-safe JEDEC trays are essential across all handling phases of static-sensitive components.
- Cleanroom and Assembly Floor Handling
- Component Shipping and Logistics
- Automated Component Feeding
- Moisture and Static Control
Customization:
Customization primarily focuses on balancing ESD properties with other critical material requirements.
- Tailored Conductivity Levels: Custom materials can be formulated to achieve specific ranges of surface resistivity (dissipative versus conductive) depending on the user's specific ESD control plan and the sensitivity of the devices being handled.
- Color and Identification: While black is standard for conductivity, customization allows for the exploration of other colors (using non-carbon-based additives) if visual identification or process segregation is a higher priority, provided the necessary ESD properties can still be maintained.
- High-Temperature ESD Materials: For applications requiring exposure to very high temperatures (e.g., for certain testing or curing processes), specialized custom-molded materials must be used that retain their dimensional and ESD properties above the typical 140°C limit of standard mid-temp trays.
- Internal Cell Optimization: The internal cell geometry is always custom-designed to the component's exact dimensions (low-profile or high-profile), ensuring a secure, ESD-safe fit that prevents movement or rubbing, which is a common generator of static charge.
