JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging

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Shenzhen Hiner Technology Co., Ltd.

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JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging

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JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging

JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging Engineered for precision and reliability, this JEDEC matrix tray delivers consistent performance across semiconductor manufacturing...

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JEDEC tray for BGA QFN packaging

custom fit IC component tray

JEDEC matrix tray for DIP

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